Message from David Hepinstall at AEA 6/1/03
|
Having registered for the MULTIFAMILY BUILDINGS 2003 Conference, June
9-11, 2003, in New York City you may have reviewed the schedule of
sessions in the registration brochure or on-line (
www.aeanyc.org ). But
you may not have noticed one of the important policy FORUMS that will be
featured at the conference. DOE Weatherization-Eligible Measures: Adding to Appendix A for Multi-Family Buildings (Wednesday, June 11 from 2:00-3:30 pm) What new technologies have the potential to increase weatherization savings in multi-family buildings? What new materials should be added to DOE's list of allowable weatherization measures? By participating in this forum you will have the opportunity to propose promising technologies and discuss their merits within the context of the US Department of Energy's Weatherization Assistance Program for Low-Income Persons. The success of this Forum session depends entirely on the participants. Input generated during the forum will be provided to DOE for consideration and possible addition to Appendix A NOTE: A new on-line system for states and local agencies to propose additions to Appendix A will be launched soon on the Weatherization Assistance Program Technical Assistance Center (WAPTAC, www.waptac.org ). The expedited application and review process will also be previewed in this session. Note: Appendix A is a part of the DOE regulations that govern the Weatherization Assistance Program. Appendix A lists materials that may be purchased with DOE funds and installed in eligible low-income dwellings. Only weatherization materials which are listed in Appendix A and which meet or exceed the safety standards prescribed in Appendix A may be purchased with DOE funds. However, DOE may approve an unlisted material upon application from any State. The moderator for the Forum will be Alex Moore of D&R International, Ltd., Silver Spring, MD 20910 PASS THIS INFORMATION ON TO YOUR COLLEAGUES WHO MAY NOT ALREADY HAVE REGISTERED BUT MAY HAVE SOMETHING IMPORTANT TO CONTRIBUTE IN THIS FORUM AND IN THE CONFERENCE AS A WHOLE.! |